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Liquid Cooling

We offer thermal managment  solutions for grund, navel, and airborne military applications, such as power supplies, communication solutions and other electronics devices.  

We provide off-the-shelf solutions, with relatively short lead times. These products can also be modified to meet customer's specific requirements, provided the modification can be implemented on an existing design.

We provide fully customized designs, along with thermal / flow analyses, to deliver an optimized solution, according to customer requirements.


  • High thermal performance – Up to 5 [kW] power dissipation per plate.
  • Low thermal resistance (plate-to-liquid).
  • High-pressure burst proof: Tested at 400 [psi]
  • Leak proof: Tested at 300 [psi].
  • Manufactured using convectional CNC milling process.
  • Lightweight.
  • Low liquid-pressure drop (input-to-output).
  • :Easy connections to user system:
    • standard quick-release couplings.
    • Blind-mate, no-spill couplings.
    • Can be modified according to customer requirements
  • Adapters (optional):
    • Hard anodized coated (for galvanic corrosion protection).
    • Allows secure connection/disconnection of the coupler/nipple, without damaging the cold plate.
  • Adjustable flow orifice – pressure control according to requirements.
  • Thermal / flow & structural analyses.
  • All plates are tested to verify performance (ATP).


  • Power supplies
  • Power amplifiers
  • Electronic devices
  • Server rooms

Controlled Design Parameters

  • Plate shaping according to heat dissipation map.
  • Max plate temperature rise.
  • Flow rate consideration & Pressure drop.
  • Geometry and weight.

Thermal Solutions Capabilities?

See our thermal managemement solutions expertise and designs here

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Cooling unit with fans
SeriesDimensionsPlate thicknessFlow ratePower dissipationThermal resistance (°C/W)

Milpower Source Inc.

P.O. Box 810
7 Field Lane
Belmont, NH 03220
United States

P: (603) 267-8865

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